A new study title “Wafer Fabrication market size, status and forecast 2027” has been featured on market research future.


Market Overview:

The Global Wafer Fabrication Market is expected to grow from USD 50.56 billion in 2018 to USD 62 Billion by 2025, at a CAGR of 4% during the forecast period. Wafer fabrication is a process of manufacturing different electronic components used in consumer electronic and other electronic and electrical devices. With the growing number of electronic devices over the last decade, the need for electronic components such as electronic circuits and semiconductors has increased. Additionally, various government initiatives have encouraged companies to invest and establish manufacturing facilities locally. For instance, in 2016, the Government of India started ‘Make in India’ campaign and invited global companies to India to start their businesses. Therefore, the growing adoption of consumer electronics products and devices across the globe has led to the growth of the global wafer fabrication market. Additionally, growing telecom industry contributes to the growth of the global wafer fabrication market. Rapid advances in technology and the advancements in network circulation from voice to integrated voice, video, and data have fueled the manufacturing of smartphones and other electronic devices used in network and telecommunication applications; this has resulted in higher demand for electronic components and fabrication process. Hence, growth in the telecom sector is one of the major factors contributing to the growth of the global wafer fabrication market.

Semiconductors or electronic circuits are used in every electronic device; these components undergo a complicated and time-consuming manufacturing process. Polycrystalline silicon is most commonly used raw material for wafer fabrication. Wafer fabrication process includes a series of steps and generally takes 10 to 30 days for completion. The steps involved in the fabrication process are thermal oxidation or deposition, masking, etching, doping, dielectric deposition and metallization, passivation, electrical test and assembly. Semiconductor equipment plays a vital role in integrated circuit (IC) manufacturing. Thus, semiconductor wafer fabrication is used to manufacture circuits, which are used in electronic and electrical devices.


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Key Players:

Some of these players are Tokyo Electron Limited (Japan), KLA-Tencor Corporation (US), Lam Research Corporation (US), ASML Holding NV (Netherlands), Motorola Solutions, Inc. (US), Intel Corporation (US), Applied Materials, Inc. (US), SCREEN Semiconductor Solutions Co., Ltd (Japan), SAMSUNG (South Korea), Hitachi High-Technologies Corporation (Japan), and others.



The wafer fab market has been studied extensively, keeping in mind the primary segments of equipment type, fabrication process and end user.

The equipment types considered in the report are ion implantation equipment, diffusion systems, oxidation systems, photolithography equipment, epitaxial reactors, and others.

The fabrication processes studied are front end of line processing as well as back end of line processing.

The primary end-users listed include memory manufacturer along with integrated device manufacturer.



Regional Analysis:

The geographic distribution of the wafer fabrication market covers Europe, the Middle East & Africa or MEA, Central and South America, Asia Pacific or APAC and North America.

The biggest chunk of the global market belongs to APAC, thanks to the high concentration of well-known semiconductor equipment manufacturers and the improving financial conditions. The rising number of government initiatives has prompted the companies to significantly invest in the development of new semiconductor fabrication plants across the region. Accelerated demand for wafer fabrication technology in the consumer electronics sector and the surge in technological innovations in the telecom as well as semiconductor sectors also promote growth of the wafer fab equipment market in the region.


However, the fastest gaining market during the review period will be owned by North America, primarily owing to the heightened adoption rate of consumer electronics devices. Significant innovations in wafer technologies along with the increasing adoption of wafer fab technology in newer applications can translate to excellent growth prospects for the regional market.

The MEA market can observe tremendous growth in the ensuing period, mostly due to the continuous expansion of the telecom industry.


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